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NTTFS5811NL
Power MOSFET
40 V, 53 A, 6.4 m W
Features
? Low R DS(on)
? Low Capacitance
? Optimized Gate Charge
? These Devices are Pb ? Free and are RoHS Compliant
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
40 V
http://onsemi.com
R DS(on) MAX
6.7 m W @ 10 V
10 m W @ 4.5 V
I D MAX
53 A
Parameter
Symbol
Value
Unit
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
V DSS
V GS
40
± 20
V
V
N ? Channel MOSFET
D (5 ? 8)
Continuous Drain
Current R q JA (Note 1)
T A = 25 ° C
T A = 100 ° C
I D
17
10
A
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JC (Note 1)
Steady
State
T A = 25 ° C
T A = 100 ° C
T C = 25 ° C
T C = 100 ° C
P D
I D
2.7
1.1
53
33
W
A
G (4)
S (1,2,3)
MARKING DIAGRAM
R q JC (Note 1)
Power Dissipation T C = 25 ° C
T C = 100 ° C
Pulsed Drain Current t p = 10 m s
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(L = 0.1 mH)
P D
I DM
T J ,
T stg
I S
E AS
I AS
33
13
211
? 55 to
+150
53
65
36
W
A
° C
A
mJ
A
1
WDFN8
( m 8FL)
CASE 511AB
5811
A
Y
WW
G
1
S
S 5811
S AYWW G
G G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb ? Free Package
D
D
D
D
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T L
260
° C
(Note: Microdot may be in either location)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device Package Shipping ?
THERMAL RESISTANCE MAXIMUM RATINGS
NTTFS5811NLTAG
WDFN8
(Pb ? Free)
1500 /
Tape & Reel
Parameter
Junction ? to ? Case – Steady
State (Note 1)
Junction ? to ? Ambient – Steady
State (Note 1)
Symbol
R q JC
R q JA
Value
3.8
47
Unit
° C/W
NTTFS5811NLTWG WDFN8 5000 /
(Pb ? Free) Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
1. Surface ? mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces.
? Semiconductor Components Industries, LLC, 2011
November, 2011 ? Rev. 3
1
Publication Order Number:
NTTFS5811NL/D
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